70,00
€
inkl. MwSt
- Verlag: Fraunhofer Verlag
- Genre: keine Angabe / keine Angabe
- Seitenzahl: 166
- Ersterscheinung: 09.02.2016
- ISBN: 9783839609569
Simulation based analysis of LED package reliability regarding encapsulant related failures
Within the work several LED encapsulation material related reliability issues are investigated by means of finite element analysis (FEM). The typically used silicone and epoxy materials are mechanically characterized after subjecting them to different environmental conditions. Based on these investigations material models for the FEM are created. Finally, the material models are used to simulate some encapsulation related reliability issues.
Dieses Produkt bei deinem lokalen Buchhändler bestellen
Meinungen aus der Lesejury
Es sind noch keine Einträge vorhanden.